Dage BT22 MicroTester 22 – Wire Shear/Pull Tester
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Description
The Dage BT22 MicroTester 22 is a specialized wire shear and pull tester designed for evaluating the mechanical strength and integrity of wire bonds, solder joints, and other microelectronic connections. Manufactured by Dage, this tester offers precise and repeatable testing capabilities, making it an essential tool for quality control and reliability assessment in industries such as electronics manufacturing and materials science.
Specifications:
– Testing Modes: The BT22 MicroTester 22 supports both wire shear and wire pull testing modes, allowing for comprehensive evaluation of bond strength and reliability.
– Force Measurement Range: The tester is capable of applying controlled forces in a range suitable for microelectronic applications, ensuring accurate and sensitive measurements.
– Test Speed: Adjustable test speeds enable optimization of test conditions for different bond configurations, materials, and testing requirements.
– Precision: Offers high precision and repeatability in force measurements, providing reliable data for assessing bond strength and failure modes.
– Data Acquisition: Includes data acquisition capabilities for capturing and storing test data, such as force-displacement curves, peak force values, and failure analysis information.
– Touchscreen Interface: Features an intuitive touchscreen interface for easy test parameter setup, real-time data monitoring, and result analysis.
– Compatibility: Compatible with a range of fixtures and accessories for testing various bond types, sizes, and configurations commonly found in microelectronic assemblies.
– Software Integration: Integrates with dedicated software platforms for test programming, data management, report generation, and statistical analysis of test results.
– Safety Features: Incorporates safety mechanisms such as overload protection, emergency stop functions, and user-defined safety limits to ensure operator safety during testing operations.
– Application: Suitable for testing wire bonds, ribbon bonds, ball bonds, solder joints, adhesives, and other mechanical connections in microelectronic components and assemblies.
– Compliance: Meets industry standards and regulations for bond testing equipment, ensuring compliance with quality control, reliability, and safety requirements.
Laboratory Calibration
Micro Precision operates 36 laboratories globally providing reliable localized support
- Certified metrologists staffing laboratories in North America, Central America, South America, Europe, Asia, and the Middle East
- Comprehensive scopes of accreditation to meet a broad range of customer needs
- Expedited calibration services available
- Pickup and delivery services available
- Environmentally controlled facilities to ensure high quality and accurate calibrations and measurements.
Laboratory Calibration
Micro Precision operates 36 laboratories globally providing reliable localized support
- Certified metrologists staffing laboratories in North America, Central America, South America, Europe, Asia, and the Middle East
- Comprehensive scopes of accreditation to meet a broad range of customer needs
- Expedited calibration services available
- Pickup and delivery services available
- Environmentally controlled facilities to ensure high quality and accurate calibrations and measurements.
Quality Certified Test Equipment Repair Services
When a piece of equipment fails you have the option to repair or replace that item. Oftentimes repair is an economical and efficient solution. Micro Precision’s repair offering provides advantages to our customers:
- Cost effective; often less than OEM
- Efficient; often much better turn-time than the OEM
- Flexibility; willingness to work with customers to meet their needs
- Warranted repairs
- Ability to service many obsolete instruments
Quality Certified Test Equipment Repair Services
When a piece of equipment fails you have the option to repair or replace that item. Oftentimes repair is an economical and efficient solution. Micro Precision’s repair offering provides advantages to our customers:
- Cost effective; often less than OEM
- Efficient; often much better turn-time than the OEM
- Flexibility; willingness to work with customers to meet their needs
- Warranted repairs
- Ability to service many obsolete instruments
Cost Effective Test Equipment Options
From the leasing of specialized electronic equipment for a specific task, to the purchase of physical and dimensional tools, we offer leasing services as well as used test equipment sales. We also locate hard-to-find electronics, and provide flexible options to meet ever-changing equipment needs.
Cost Effective Test Equipment Options
From the leasing of specialized electronic equipment for a specific task, to the purchase of physical and dimensional tools, we offer leasing services as well as used test equipment sales. We also locate hard-to-find electronics, and provide flexible options to meet ever-changing equipment needs.
Our Capabilities
Micro Precision can perform instrument calibration services on equipment from variety of applications for specific industries and lines of business. If you have a calibration need that is not listed in this area, please contact us.
Electrical
Micro Precision accredited electrical calibration lab services with multimeter, multifunction calibrator, oscilloscope, and power supply capabilities.
Optical
Micro Precision accredited optical, light, and fiber optic calibration lab services.
Thermodynamics & Chemical
Micro Precision accredited thermodynamic & chemical calibration lab services with temperature, humidity, life science, and pharma capabilities.
RF - Microwave
Micro Precision accredited RF & microwave calibration lab services.
Mechanical & Dimensional
Micro Precision accredited mechanical and dimensional calibration lab services with pressure, torque, force, flow, velocity, and aircraft jack load capabilities.
Laboratory Standards
Calibration laboratory standards are critical for your organization’s most accurate measurements.
Semiconductor Calibration
Micro Precision utilizes state-of-the-art technology to analyze semiconductor wafer thickness and step height.